Description
LGA1851 AND LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer, way to even CPU contact surface
NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors – 5mm offset for optimal coverage of the CPU hotspot, resulting in more efficient heat transfer
ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that moreover cools components within the base area, such as voltage converters
INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses, this means that that just one visible cable is hooked up to the motherboard
LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers at the M.2_1 slot may end up in compatibility problems. An overview and solution is to be had within the technical data, within the manual and at the manufacturer’s website online. Please use the compatibility check
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